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Related publications for thermal and electrothermal models in reverse chronological order

Content:

W. Teulings, I. Schmadlak, T. Hauck.
Thermal simulation of smart power devices on PCB with SPICE.
International Exhibition and Conference for Power Electronics, PCIM 2010, Nuernberg, 4 - 6 Mai 2010.

E. B. Rudnyi.
Effective Electrothermal Simulation for Battery Pack and Power Electronics in HEV/EV.
3rd Virtual Vehicle Symposium in Graz, GSVF, 6-7 May, 2010.

T. Bechtold, D. Hohlfeld, E. B. Rudnyi, M. Guenther.
Efficient extraction of thin film thermal parameters from numerical models via parametric model order reduction.
J. Micromech. Microeng. v. 20, N 4, 045030, 2010.
Paper at JMM

2009

E. B. Rudnyi.
Thermal and Mechanical System Simulation.
ANSYS Conference & 27. CADFEM Users Meeting, 18 - 20 November 2009, Congress Center Leipzig.

E. B. Rudnyi.
Simulation of IGBT converter.
ANSYS Conference & 27. CADFEM Users Meeting, 18 - 20 November 2009, Congress Center Leipzig.

L. Kostetzer.
System Level Battery Thermal Behaviour Study.
ANSYS Conference & 27. CADFEM Users Meeting, 18 - 20 November 2009, Congress Center Leipzig.

T. Hauck, I. Schmadlak, L. Voss, E. B. Rudnyi.
Electro-Thermal Simulation of Multi-channel Power Devices: From Workbench to Simplorer by means of Model Reduction.
NAFEMS, Seminar: Multi-Disciplinary Simulations - The Future of Virtual Product Development, 9-10 November 2009, Wiesbaden, Germany, paper #5, 10 p.

T. Hauck, W. Teulings, E. B. Rudnyi.
Electro-Thermal Simulation of Multi-channel Power Devices on PCB with SPICE.
THERMINIC 2009, 7-9 October, Leuven, Belgium, 6 p.

T. Bechtold, D. Hohlfeld, E. B. Rudnyi.
Efficient extraction of thin film thermal properties via parametric model order reduction and optimization.
Transducers 2009, June 21-25, 2009 - Denver, Colorado, USA.

T. Bechtold, D. Hohlfeld, E. B. Rudnyi.
Efficient Solution of Inverse Thermal Problem via Parametric Model Order Reduction.
EuroSimE 2009, Delft, The Netherlands, April 2009.

2008

U. Franke, T. Ellinger, J. Petzoldt.
Thermal modelling of power electronic systems using model order reduction of large scale finite elemente models.
PCIM 2008, Power Conversion Intelligent Motion, Nuernberg, 27 - 29 Mai 2008.

A. Dehbi, W. Wondrak, E. B. Rudnyi, U. Killat, P. van Duijsen.
Efficient Electrothermal Simulation of Power Electronics for Hybrid Electric Vehicle.
Eurosime 2008, International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 21 - 23 April, Freiburg, Germany, Proceedings of EuroSime 2008, p. 412-418.

2007

P. v. Duijsen.
Simulating Power Electronics, Electrical Machines, Control and Thermal Cycling in ANSYS and Caspoc.
ANSYS Conference & 25. CADFEM Users Meeting, 21. - 23. November 2007, Internationales Congress Center Dresden.

A. Augustin, B. Maj.
Thermal Simulation with Coupled Network Models on System Level.
Eurosime 2007, Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 16-18 April, London, England.

A. Augustin, T. Hauck.
A New Approach to Boundary Condition Independent Compact Dynamic Thermal Models..
23rd IEEE SEMI-THERM, 2007, Proceedings, pp. 228-232. March 1822, San Jose.

2006

T. Bechtold, E. B. Rudnyi
Model Order Reduction for Dynamic Electro-Thermal Simulation of Microsystems.
Communications to SIMAI Congress, ISSN 1827-9015, v. 1, 2006, 6 p.

A. Augustin, T. Hauck.
Transient Thermal Compact Models for Circuit Simulation.
Paper 2.5.3. 24th CADFEM Users Meeting 2006, International Congress on FEM Technology with 2006 German ANSYS Conference, October 25-27, 2006 Schwabenlandhalle Stuttgart/Fellbach, Germany.

A. Augustin, T. Hauck, B. Maj, J. Czernohorsky, E.B. Rudnyi and J.G. Korvink.
Model Reduction for Power Electronics Systems with Multiple Heat Sources .
THERMINIC 2006, 12th International Workshop on Thermal Investigations of ICs and Systems, 27-29 September 2006, Nice, France.

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2005

L. H. Feng, E. B. Rudnyi, J. G. Korvink.
Preserving the film coefficient as a parameter in the compact thermal model for fast electro-thermal simulation.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, December, 2005, v. 24, N 12, p. 1838-1847.
Final paper at IEEE.

T. Bechtold, E. B. Rudnyi, J. G. Korvink.
Dynamic electro-thermal simulation of microsystems: a review.
Journal of Micromechanics and Microengineering 2005, v. 15, N 11, p. R17-R31.
Preprint, Final paper at IOP.

T. Bechtold, E. B. Rudnyi, J. G. Korvink.
mor4ansys: Efficient Model Order Reduction of Finite Element Electro-Thermal MEMS Models.
Microsystemtechnik Kongress 2005, 10-12 October, Freiburg, Germany, VDE Verlag GMBH, p. 649-652.

E. B. Rudnyi, L. H. Feng, M. Salleras, S. Marco, J. G. Korvink.
Error Indicator to Automatically Generate Dynamic Compact Parametric Thermal Models .
THERMINIC 2005, 11th International Workshop on Thermal Investigations of ICs and Systems, 27 - 30 September 2005, Belgirate, Lake Maggiore, Italy, p. 139 - 145.

T. Bechtold, D. Hohlfeld, E. B. Rudnyi, H. Zappe, J. G. Korvink.
Inverse Thermal Problem via Model Order Reduction: Determining Material Properties of a Microhotplate .
THERMINIC 2005, 11th International Workshop on Thermal Investigations of ICs and Systems, 27 - 30 September 2005, Belgirate, Lake Maggiore, Italy, p. 146 - 150.

T. Bechtold, E. B. Rudnyi, J. G. Korvink, M. Graf, A. Hierlemann.
Connecting heat transfer macromodels for MEMS-array structures.
Journal of Micromechanics and Microengineering 2005, v. 15, N 6, p. 1205-1214.
Preprint, Final paper at IOP.

E. B. Rudnyi and J. G. Korvink.
Boundary Condition Independent Thermal Model.
In: Benner, P., Mehrmann, V., Sorensen, D. (eds) Dimension Reduction of Large-Scale Systems, Lecture Notes in Computational Science and Engineering (LNCSE). Springer-Verlag, Berlin/Heidelberg, Germany, v. 45, p. 345-348, 2005.
Book at Springer.

C. Moosmann, E. B. Rudnyi, A. Greiner, J. G. Korvink, M. Hornung.
Parameter preserving Model Order Reduction of a Flow Meter.
Technical Proceedings of the 2005 Nanotechnology Conference and Trade Show, Nanotech 2005, May 8-12, 2005, Anaheim, California, USA, NSTI-Nanotech 2005, vol. 3, p. 684-687.
Final paper at NSTI.

M. Salleras, T. Bechtold, L. Fonseca, J. Santander, E. B. Rudnyi, J. G. Korvink, S. Marco,
Comparison of Model Order Reduction Methodologies for Thermal Problems.
In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Proceedings of EuroSimE 2005, Berlin, Germany, April 18-20, 2005, p. 60-65.
Final paper at IEEE

L. H. Feng, E. B. Rudnyi, J. G. Korvink, C. Bohm, T. Hauck.
Compact Electro-thermal Model of Semiconductor Device with Nonlinear Convection Coefficient.
In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Proceedings of EuroSimE 2005, Berlin, Germany, April 18-20, 2005, p. 372-375.
Final paper at IEEE

T. Bechtold, E. B. Rudnyi and J. G. Korvink,
Error indicators for fully automatic extraction of heat-transfer macromodels for MEMS.
Journal of Micromechanics and Microengineering 2005, v. 15, N 3, pp. 430-440.
Preprint, Final paper at IOP.

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2004

L. H. Feng, E. B. Rudnyi, J. G. Korvink.
Parametric Model Reduction to Generate Boundary Condition Independent Compact Thermal Model.
THERMINIC 2004, 10th International Workshop on Thermal Investigations of ICs and Systems, 29 September - 1 October 2004, Sophia Antipolis, France, p. 281-285.

C. Moosmann, E. B. Rudnyi, A. Greiner, J. G. Korvink,
Model Order Reduction for Linear Convective Thermal Flow.
THERMINIC 2004, 10th International Workshop on Thermal Investigations of ICs and Systems, 29 September - 1 October 2004, Sophia Antipolis, France, p. 317-321.

C. Bohm, T. Hauck, E. B. Rudnyi, J. G. Korvink,
Compact Electro-thermal Models of Semiconductor Devices with Multiple Heat Sources.
Proceedings of 5th International conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004, May 10-12, 2004, Brussels, Belgium, p. 101 - 104.
Final paper at IEEE

T. Bechtold, E. B. Rudnyi and J. G. Korvink,
Error Estimation for Arnoldi-based Model Order Reduction of MEMS.
Technical Proceedings of the 2004 Nanotechnology Conference and Trade Show, Nanotech 2004, March 7-11, 2004, Bosten, Massachusetts, USA, vol. 2, p. 430-433.
Final paper at NSTI.

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2003

T. Bechtold, E. B. Rudnyi, J. G. Korvink and C. Rossi,
Efficient Modelling and Simulation of 3D Electro-Thermal Model for a Pyrotechnical Microthruster.
International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications PowerMEMS 2003, Makuhari, Japan, 4-5 December 2003.

T. Bechtold, E. B. Rudnyi and J. G. Korvink,
Automatic Generation of Compact Electro-Thermal Models for Semiconductor Devices.
IEICE Transactions on Electronics, 2003, v. E86C, N 3, pp. 459 - 465.
Final paper at IEICE.

J. G. Korvink, E. B. Rudnyi,
Keynote: Computer-aided engineering of electro-thermal MST devices: moving from device to system simulation.
EuroSimE'03, 4th international conference on thermal & mechanical simulation and experiments in micro-electronics and micro-systems, Aix-en-Provence, France, March 30 - April 2, 2003.

T. Bechtold, B. Salimbahrami, E. B. Rudnyi, B. Lohmann and J. G. Korvink,
Krylov-Subspace-Based Order Reduction Methods Applied to Generate Compact Thermo-Electric Models for MEMS.
NANOTECH 2003 (MSM 2003), Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, 2003, v. 2, February 23-27, San Francisco, Computational Publications, San Francisco, p. 582 - 585.
Final paper at NSTI.

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2002

T. Bechtold, E. B. Rudnyi, J. G. Korvink.
Automatic Order Reduction of Thermo-Electric Models for MEMS: Arnoldi vs. Guyan.
The Fourth International Conference on Advanced Semiconductor Devices and Microsystems, ASDAM 2002, Smolenice Castle, Slovakia, 2002, p. 333-336.
Paper at IEEE.

T. Bechtold, E. B. Rudnyi, J. G. Korvink.
Automatic Order Reduction of Thermo-Electric Models for Micro-Ignition Unit.
International Conference on Simulation of Semiconductor Processes and Devices SISPAD 2002, Kobe, Japan, 2002, p.131-134.
Paper at IEEE.

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Evgenii B. Rudnyi, CADFEM
My e-mail is erudnyi at cadfem point de. Phone is +49 8092 7005 82.

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Masha Rudnaya